SuwonSamsung will clean 50,000 glass carriers a month next year.
Industry analysts say that volume implies at least doubled high-bandwidth memory output.
Glass carriers hold memory wafers in place while they are ground thin and drilled, before stacking 12 or more layers.
Industry sources expect Samsung’s wafer input to rise only about 40%, to 250,000 a month.
The newest chip generation’s share of Samsung’s high-bandwidth shipments is projected to rise from 40% to 80% next year.
How each outlet framed it
- Hacker News
- emphasizes glass carriers as enabling constraint for HBM scaling (10k→20k→50k monthly sheets required)
Sources: Hacker News