Huawei Details Kirin 9050

ShanghaiHuawei says its Kirin 9050 uses over 50 million hybrid bonds.

Huawei claims 140% more neural-processor throughput, 40% more graphics performance and 12.7% higher processor clocks.

Logic folding splits the circuit into stacked layers joined by hybrid bonds at a 1.5-micrometre pitch, rather than shrinking transistors.

Huawei plans to tighten the bonding pitch to 1 micrometre in 2027.

Sources: Zhidx